A venture in retrotronics
This is a breakout board for the TI TLC5947 IC, a constant-current LED driver supporting 24 channels, and 12-bit PWM control per channel. Unfortunately this powerful yet easy to drive IC is only available in high-density packages that are hard to solder without special equipment and skill. Even more so considering that the TSSOP package not only features a 0.65mm pitch but also requires an integrated heat sink underneath — this is what TI calls a DAP/PowerPAD Thermally Enhanced package. That means that there is a thermal pad at the bottom side of this HTSSOP package which needs to be connected (i.e. soldered) to a heat sink (i.e. two or more copper planes connected through thermal vias) integrated (i.e. designed) into the PCB.