A venture in retrotronics
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KiCad footprint for TSSOP-32 package, 6.1x11mm size, 0.65mm pitch, with PAD for TLC5947
This KiCad library contains a single footprint specifically for TI TLC5947 ICs, comprised of a TSSOP-32 package in 6.1x11mm size, 0.65mm pitch, and a PowerPAD thermal pad.
Information
Created
Saturday, 09 June 2018 13:50
Changed
Version
20180609
Size
1.36 KB
Created by
Adrian Offerman
Changed by
Super User
Downloads
1,823
License
Creative Commons BY-NC 
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