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KiCad footprint for TSSOP-32 package, 6.1x11mm size, 0.65mm pitch, with PAD for TLC KiCad footprint for TSSOP-32 package, 6.1x11mm size, 0.65mm pitch, with PAD for TLC5947 HOT

This KiCad library contains a single footprint specifically for TI TLC5947 ICs, comprised of a TSSOP-32 package in 6.1x11mm size, 0.65mm pitch, and a PowerPAD thermal pad.

AOI-TSSOP-32_6.1x11mm_Pitch0.65mm_TLC5947PAD-screenshot
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Created Saturday, 09 June 2018 13:50
Changed
Version 20180609
Size 1.36 KB
Created by Adrian Offerman
Changed by Super User
Downloads 1,120
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